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The channel contention access principle of Wi-Fi. The core of Wi-Fi equipment access lies in carrier sense multiple access / collision avoidance (CSMA/CA). This mechanism of listening before speaking has been in use since the first generation of Wi-Fi (802.11) in 1997. However, there were few wireless network devices more than 20 years ago, and no one would consider the network congestion caused by competition when the number of devices increased. The real popularity of Wi-Fi began with Wi-Fi 4 (802.11n) in 2008. It can be said that since then, Wi-Fi has really become the most common form of Internet access for homes and businesses. The number of device models that support Wi-Fi has also increased exponentially.
Due to the spread of the global COVID-19 epidemic in 2020, automobile production is in the doldrums (figure 1). The number of cars produced worldwide, which was 92.18 million in 2019 before the COVID-19 epidemic, fell by 14.56 million to 77.62 million in 2020 and appears to have fallen by 1.2 million to 76.42 million in 2021. The decline in car production in 0A2020 was caused by the COVID-19 epidemic, which led to a sharp drop in demand. However, the downturn in car production in 2021 is mainly due to a shortage of semiconductors. In fact, by 2021, the shortage of semiconductors has made it impossible to build cars, and the governments of Japan, the United States and Germany, with automobile as the core industry, have made requests to TSMC to increase the production of on-board semiconductors through the government of Taiwan. The semiconductors in short supply at that time were 28nm logic semiconductors and MCU (Micro Controller Units, commonly known as “microcontrollers”).
The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.
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